R&d scientist micro assembly

The Photonic Integration Technology Center (PITC) is a leading R&D institute, founded by the Eindhoven University of Technology (TUe), the University of Twente (UT), the Netherlands organization for applied scientific research (TNO located at Holst Centre) and PhotonDelta. PITC's mission is to accelerate the uptake of integrated photonics by helping industrial partners close the bridge from research to commercialization and help to solve some of society’s biggest challenges, by working on applications ranging from road safety and health monitoring to energy-efficient data handling and communication to data security.

PITC is located in Eindhoven and Enschede in The Netherlands, and makes use of excellent research facilities: the NanoLabs in Eindhoven and Enschede, with world-leading technology platforms based on resp. indium phosphide and silicon nitride, and the heterogenous integration platform of InP and SiN developed at the high tech campus in Eindhoven.

As an R&D Scientist at PITC, you will be instrumental in advancing the high-precision assembly and interconnect of photonic components. Your work will contribute to the development of more efficient and compact photonic-electronic systems applicable in advanced communication systems, medical devices, and beyond. Working at the intersection of materials science, process technology, microelectronics, and packaging, you will conduct experimental investigations and employ advanced modeling techniques to design optimized material/process combinations. These will facilitate the successful assembly and interconnect of new photonic components onto various substrates. Your expertise in micro-assembly techniques and materials will drive the adoption of this technology as a mainstream manufacturing solution for photonic components. If you have a background in high-precision chip alignment and experience in photonics, semiconductors, or related fields, we encourage you to apply.

Key responsibilities:

• Design, fabricate, and validate optical and electronic interconnect and assembly processes for next-generation photonic devices and systems.
• Guide and support the acquisition of commercial chip assembly equipment.
• Participate in the development of high-speed (> 10,000 UPH) and high-accuracy assembly processes.
• Collaborate on projects with international customers, sharing your expertise and taking on key responsibilities.

• PhD in mechanical engineering, electrical engineering or materials science.
• Preferably 5 years of experience in semiconductor industry in the field of advanced chip packaging and high-precision chip assembly.
• Proven experience in designing and fabricating optical and electronic interconnects.
• Strong communication skills, enabling effective collaboration with international partners.

YER Technology offers you the possibility to join as Engineering Professional and to combine challenging assignments with extensive application and career guidance. The following conditions are applicable:

• Attractive salary according to the standards of our clients
• 25 holidays per year and the option to buy more holidays. Together with that it's possible to get ATV days if applicable
• A temporary or permanent contract with YER
• The possibility to join (y)our client directly after one year
• Travel expense reimbursement
• Good pension scheme
• Every hour of overtime will be compensated
• Open and transparent communication with your personal consultant
• Free Dutch classes
• Personal career coaching from our occupational psychologists
• Broad technical and softs skills training opportunities
• A Service Desk ready to answer all your practical questions